Vol 13, No 2 (2009) > Articles >

Intermetallic Cu3Sn Phase Layer on Electrode’s Tip of Galvanized Resistance Spot Welding

Muhammad Anis 1 , Aulia Irsyadi 1 , Deni Ferdian 1

Affiliations:

  1. Departemen Metalurgi dan Material, Fakultas Teknik, Universitas Indonesia, Depok 16424, Indonesia

 

Abstract:

A resistance spot welding method is commonly used in automotive industries application. In a resistance spot welding method, the copper electrode has a significant role as an electric current carrier for joining thin metal sheet. This research was focused on studying the effect of tin layer at the electrode tip for joining galvanized steel sheet. The main variable of this research is in the thickness of the intermetallic Cu3Sn layer. The result showed that the introduction of tin layer less than 1 μm in thickness on the electrode tip gives a comparable shear strength and nugget diameter distribution with the unplated electrode tip.

Keywords: intermetallic Cu3Sn, shear strength and nugget diameter, spot welding
Published at: Vol 13, No 2 (2009) pages: 91-95
DOI:

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References:

Y.J. Chad, Failure of Spot Weld: A competition between crack mechanics and plastic collapse, Recent Advances in Experimental Mechanics, Gdoutos E.E, Springer, Netherland, 2004, p 245.

M. El-Banna, D. Filev, R.B. Chinnam, Computational Intelligence in Automotive Application, Springer, Berlin, 2008, p.291.

H.A. Nied, Welding J. 63/4 (1984) 123.

H. Tang, W. Hou, S.J Hu, H. Zhang, Welding J. 97/7 (2007) 175.

B. Bouyousfi, T. Sahraoui, S. Guessasma, K.T. Chaouch, Materials & Design 28/2 (2007) 414.

Z-S Wu, P Shan, R Lian,S-S Hu, Materials & Design, 24/8 (2003) 687

N.T Williams, J.D Parker, International Materials Reviews, 49/2 (2004) 77

Wei Li . Manuf. Sci. Eng, 127/4 (2005) 709

S.A Gedeon, T.W Eagar, Metallurgical and Material Trans B. 17/4 (1986) 879.

Anon., Handbook for Resistance Spot Welding, Miller, Appleton, Wisconsin, 2005, p.6.

T Nosetani, K Namba, H Sano, M Yonemitsu, M Kumagai, M. Tsunekawa, US Patent No. 5334814, 2 Agt 1994.

M.H. Lu dan K.C. Hsieh, Journal of Electronic Materials, 36/11 (2007) 1448.

R.J.K. Wassink, Soldering in Electronics, 2nd ed., Isle of. Man, British Isles: Electrochemical Publications Limited, 1989, p.149.